DocumentCode :
803657
Title :
Design, fabrication, and characterization of low forward drop, low leakage, 1-kV 4H-SiC JBS rectifiers
Author :
Zhu, Lin ; Chow, T. Paul ; Jones, Kenneth A. ; Agarwal, Anant
Author_Institution :
Center for Integrated Electron. & Electron. Manuf., Rensselaer Polytech. Inst., Troy, NY, USA
Volume :
53
Issue :
2
fYear :
2006
Firstpage :
363
Lastpage :
368
Abstract :
The 1-kV 4H-SiC planar junction barrier Schottky (JBS) rectifiers were designed, fabricated, and characterized. Different p+ implantation dosages and activation anneal methods were used to determine an optimum baseline process. Using the optimized process, the forward drop of our JBS rectifiers is <1.5 V while the reverse leakage current density is <1×10-5 A/cm-2. Blocking voltage>1 kV was achieved using a single-zone junction termination extension termination. It was shown experimentally that 4-μm p-type implantation window spacing gives an optimum tradeoff between forward drop voltage and leakage current density for these rectifiers, yielding a specific on-resistance of 3 mΩ·cm2.
Keywords :
Schottky barriers; Schottky diodes; current density; leakage currents; power semiconductor diodes; semiconductor doping; semiconductor junctions; silicon compounds; wide band gap semiconductors; 1 kV; SiC; activation anneal methods; leakage current density; p+ implantation dosages; planar junction barrier Schottky rectifiers; Annealing; Boron; Breakdown voltage; Fabrication; Implants; Leakage current; Rectifiers; Schottky barriers; Silicon carbide; Temperature; 4H–SiC; AlN; Schottky rectifier; anneal; fabrication; junction barrier Schottky (JBS);
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/TED.2005.862704
Filename :
1580875
Link To Document :
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