Title :
An Improved Transducer Temperature-Compensation Technique
Author :
Spencer, William H.
fDate :
5/1/1972 12:00:00 AM
Abstract :
This paper describes the theory and application of what is believed to be a new and improved method of temperature compensating the thermal zero shift and the thermal sensitivity shift of strain-gauge transducers. It is equally applicable to wire or foil, bonded or unbonded, or semiconductor gauges. It is also applicable to thermocouple compensation bridges.
Keywords :
Bonding; Bridge circuits; Capacitive sensors; Platinum; Resistors; Temperature sensors; Thermal sensors; Transducers; Voltage; Wire;
Journal_Title :
Industrial Electronics and Control Instrumentation, IEEE Transactions on
DOI :
10.1109/TIECI.1972.351101
