Title :
A Novel Soft-Switched Auxiliary Resonant Circuit of a PFC ZVT-PWM Boost Converter for an Integrated Multichip Power Module Fabrication
Author :
Yong-Wook Kim ; Jun-Ho Kim ; Ki-Young Choi ; Bum-Seok Suh ; Rae-Young Kim
Author_Institution :
Dept. of Electr. & Biomed. Eng., Hanyang Univ., Seoul, South Korea
Abstract :
This paper proposes a novel soft-switched auxiliary resonant circuit to provide a zero-voltage transition at turn on for a conventional pulsewidth-modulated boost converter in a power factor correction (PFC) application. The proposed auxiliary circuit enables a main switch of the boost converter to turn on under a zero-voltage switching condition and simultaneously achieves both soft-switched turn on and turn off. Moreover, for the purpose of an intelligent multichip power module fabrication, the proposed circuit is designed to satisfy several design constraints, including space saving, low cost, and easy fabrication. As a result, the circuit is easily realized by a low-rated MOSFET and a small inductor. Detailed operation and the circuit waveform are theoretically explained, and then simulation and experimental results are provided based on a 1.8-kW prototype PFC boost converter in order to verify the effectiveness of the proposed circuit.
Keywords :
PWM power convertors; power factor correction; resonant power convertors; PFC ZVT-PWM boost converter; PFC boost converter; circuit waveform; design constraints; integrated multichip power module fabrication; low-rated MOSFET; power 1.8 kW; power factor correction; pulse width-modulated boost converter; small inductor; soft-switched auxiliary resonant circuit; space saving; zero-voltage switching condition; zero-voltage transition; Educational institutions; Fabrication; Inductors; MOSFET; Multichip modules; RLC circuits; Switching circuits; Auxiliary resonant circuit; intelligent multichip power module; power factor correction (PFC); pulsewidthmodulated (PWM) boost converter; zero-voltage transition (ZVT);
Journal_Title :
Industry Applications, IEEE Transactions on
DOI :
10.1109/TIA.2013.2265074