DocumentCode :
805611
Title :
Setting the trap for hot carriers [MOS VLSI]
Author :
Aur, S. ; Duvvury, C. ; Hunter, W.R.
Author_Institution :
Semicond. Process & Device Center, Texas Instrum. Inc., Dallas, TX, USA
Volume :
11
Issue :
4
fYear :
1995
fDate :
7/1/1995 12:00:00 AM
Firstpage :
18
Lastpage :
24
Abstract :
The device degradation under ac and dc stress have been discussed and a relationship between the two has been established,. We have shown that the commonly used lifetime criteria of 10% linear current degradation for 10 years for a transistor under dc stress is overly conservative for representing the circuit operating lifetime. Using experimental and simulated data for inverter chains, we proposed that a meaningful equivalent lifetime based on 10% I/sub dl/ degradation under dc stress is 1 year lifetime (for a 10 year circuit lifetime based on 54b degradation in ring oscillator frequency). We also compared this criteria to actual circuit degradation for microprocessors and a DRAM. For DSP microprocessors with 0.8 μm LDD transistors, the projected lifetime was more than 200 years at 5.5 V, with a corresponding 10% I/sub dr/ lifetime of 20 years. For 1 Mb DRAMs with 1 pm LDD transistors, the 5% speed degradation lifetime at 5.5 V was more than 100 years, whereas the individual transistors had 10% I/sub dl/ lifetime of 4 years. These circuit results support the 10% I/sub dl/ transistor lifetime. We believe these criterion should be very safe and reasonable for digital IC chips currently in the field, as well as those in future design and development.
Keywords :
MOS digital integrated circuits; VLSI; hot carriers; integrated circuit reliability; 5.5 V; DRAM; DSP microprocessors; MOS circuits; VLSI; circuit operating lifetime; device degradation; digital IC chips; hot carriers; inverter chains; lifetime criteria; linear current degradation; ring oscillator; Circuit simulation; Degradation; Frequency; Hot carriers; Inverters; Microprocessors; Random access memory; Ring oscillators; Stress; Very large scale integration;
fLanguage :
English
Journal_Title :
Circuits and Devices Magazine, IEEE
Publisher :
ieee
ISSN :
8755-3996
Type :
jour
DOI :
10.1109/101.395192
Filename :
395192
Link To Document :
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