DocumentCode :
805647
Title :
Metal nanocrystal memories. I. Device design and fabrication
Author :
Liu, Zengtao ; Lee, Chungho ; Narayanan, Venkat ; Pei, Gen ; Kan, Edwin Chihchuan
Author_Institution :
Sch. of Electr. & Comput. Eng., Cornell Univ., Ithaca, NY, USA
Volume :
49
Issue :
9
fYear :
2002
fDate :
9/1/2002 12:00:00 AM
Firstpage :
1606
Lastpage :
1613
Abstract :
This paper describes the design principles and fabrication process of metal nanocrystal memories. The advantages of metal nanocrystals over their semiconductor counterparts include higher density of states, stronger coupling with the channel, better size scalability, and the design freedom of engineering the work functions to optimize device characteristics. One-dimensional (1-D) analyses are provided to illustrate the concept of work function engineering, both in direct-tunneling and F-N-tunneling regimes. A self-assembled nanocrystal formation process by rapid thermal annealing of ultrathin metal film deposited on top of gate oxide is developed and integrated with NMOSFET to fabricate such devices
Keywords :
Fermi level; electron beam deposition; electronic density of states; integrated memory circuits; metallic thin films; nanostructured materials; nanotechnology; rapid thermal annealing; self-assembly; tunnelling; work function; 1D analyses; Coulomb blockade effect; F-N tunneling regime; MOSFETs; NMOSFET; RTA; density of states; direct tunneling regime; fabrication process; gate oxide; metal nanocrystal memories; one-dimensional analyses; rapid thermal annealing; self-assembled nanocrystal formation process; size scalability; ultrathin metal film; work function engineering; Design engineering; Design optimization; Dielectrics; Fabrication; Flash memory; Nanocrystals; Random access memory; Rapid thermal processing; Scalability; Self-assembly;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/TED.2002.802617
Filename :
1027844
Link To Document :
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