A fully packaged 4×4 integrated optical switch matrix

Author

Varrazza, Riccardo ; Bricheno, Terry ; Yu, Siyuan

Author_Institution

Dept. of Electr. & Electron. Eng., Univ. of Bristol, UK

Volume

11

Issue

6

fYear

2005

Firstpage

1248

Lastpage

1254

Abstract

This paper describes a packaged and fiber array coupled 4×4 optical crosspoint switch designed for optical packet switching. Alignment and fixation techniques of two perpendicular fiber arrays to the integrated InP-based switch chip have been developed. Thermal management is also included in the packaging. The packaged devices demonstrate long-term stability and have been used in switch modules, including the packaged device and electronic interfaces.

Keywords

III-V semiconductors; indium compounds; integrated optics; integrated optoelectronics; optical arrays; optical fibres; optical switches; thermal management (packaging); 4×4 optical crosspoint switch; InP-based switch chip; alignment techniques; electronic interfaces; fiber array coupled optical switch; fixation techniques; integrated optical switch; long-term stability; optical packet switching; optical switch matrix; packaged optical switch; perpendicular fiber arrays; switch modules; thermal management; Electronic packaging thermal management; Optical devices; Optical fiber devices; Optical losses; Optical packet switching; Optical refraction; Optical switches; Optical variables control; Optical waveguides; Optical wavelength conversion; Integrated optoelectronics; micro-optics; optical cross-connect; optical crosspoint switch (OXS); optical multicast switching; optical packet switching (OPS); optoelectronic device packaging;

fLanguage

English

Journal_Title

Selected Topics in Quantum Electronics, IEEE Journal of

Publisher

ieee

ISSN

1077-260X

Type

jour

DOI

10.1109/JSTQE.2005.860994

Filename

1583640