DocumentCode :
80703
Title :
High Temperature Simulation of 4H-SiC Bipolar Circuits
Author :
Elgabra, Hazem ; Singh, Shakti
Author_Institution :
Dept. of Electr. & Comput. Eng., Khalifa Univ., Abu Dhabi, United Arab Emirates
Volume :
3
Issue :
3
fYear :
2015
fDate :
May-15
Firstpage :
302
Lastpage :
305
Abstract :
High speed and high-temperature operation capabilities are desirable features of integrated circuits. Due to their innate electrical and physical properties, silicon devices face significant hurdles at elevated temperatures, while silicon carbide devices perform remarkably well in such environments. This paper studies the performance of various high-speed 4H-SiC bipolar logic families including transistor-transistor logic, Schottky transistor-transistor logic, and emitter-coupled logic. All logic circuits have been optimized for high speed and high-temperature operations. Gate delays as low as 2.7 ns at room temperature and less than 5 ns at 500 °C have been achieved without sacrificing fan-out capability and noise margin stability.
Keywords :
bipolar logic circuits; silicon compounds; wide band gap semiconductors; Schottky transistor-transistor logic circuit; SiC; bipolar integrated circuit; bipolar logic circuit; emitter-coupled logic circuit; fan-out capability; gate delay; high temperature simulation; noise margin stability; silicon carbide device; temperature 293 K to 298 K; temperature 500 degC; transistor-transistor logic circuit; Delays; Inverters; Logic gates; Noise; Silicon carbide; Temperature; Transistors; 4H-SiC; Bipolar Integrated Circuits; ECL; High Speed; High Temperature; Logic Family; STTL; TTL; bipolar integrated circuits; high speed; high temperature; logic family;
fLanguage :
English
Journal_Title :
Electron Devices Society, IEEE Journal of the
Publisher :
ieee
ISSN :
2168-6734
Type :
jour
DOI :
10.1109/JEDS.2015.2407380
Filename :
7050233
Link To Document :
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