DocumentCode :
807585
Title :
Electrostatic fields and current-flow impact on whisker growth
Author :
Hilty, Robert D. ; Corman, Ned E. ; Herrmann, Hank
Author_Institution :
Tyco Electron., Harrisburg, PA, USA
Volume :
28
Issue :
1
fYear :
2005
Firstpage :
75
Lastpage :
84
Abstract :
Tin whisker growth is problematic due to the potential for short circuits in electronic devices. These devices are electrically active, generating electric fields, and transporting current. Controversy continues regarding the propensity for tin whiskers to grow more readily in the presence of an electrical bias, and other researchers have proposed that an electrical field can influence tin-whisker growth directions. The latter would exacerbate the problem of tin whiskers in electronic devices by potentially reducing the effective growth length required to induce electrical shorts. In this paper, we have developed a new test vehicle to examine the roles of electric field and current flow on the tendency to form tin whiskers. Parts have been exposed to various environmental conditions, similar to those proposed by the National Electronics Manufacturing Initiative (NEMI). In summary, the electrical fields used here, bias and current flow, do not significantly affect whisker growth. We will also present some analytical discussion regarding the potential of electromagnetic fields to influence whisker growth directions or deflections.
Keywords :
crystal growth; electric fields; electron device manufacture; nondestructive testing; short-circuit currents; tin; whiskers (crystal); National Electronics Manufacturing Initiative; current-flow impact; effective growth length; electrical bias; electromagnetic fields; electronic devices; electrostatic fields; short circuits; tin whisker growth; Circuit testing; Current density; Electric potential; Electrodes; Electromagnetic analysis; Electrostatics; Environmentally friendly manufacturing techniques; Nickel; Tin; Vehicles; Electrostatic; lead-free; tin; whisker;
fLanguage :
English
Journal_Title :
Electronics Packaging Manufacturing, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-334X
Type :
jour
DOI :
10.1109/TEPM.2005.847814
Filename :
1430810
Link To Document :
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