A systems perspective on digital interconnection technology

Author

Nordin, Ronald A. ; Levi, A.F.J. ; Nottenburg, Richard N. ; O´Gorman, J. ; Tanbun-Ek, T. ; Logan, Ralph A.

Author_Institution

AT&T Bell Lab., Naperville, IL, USA

Volume

10

Issue

6

fYear

1992

fDate

6/1/1992 12:00:00 AM

Firstpage

811

Lastpage

827

Abstract

The work describes, from a switching system designers perspective, present digital interconnection technologies and needs. The discussion begins at the chip-to-chip interconnection level and proceeds to the frame-to-frame level. The authors evaluate the optimal packaging and interconnection technology that should be used in future system designs. The analysis suggests that parallel optical data links based on a laser array technology implemented at the board-to-board level are presently advantageous. This analysis, as well as a detailed description of laser gate arrays, is also included

Keywords

optical interconnections; packaging; semiconductor laser arrays; chip-to-chip interconnection level; digital interconnection technology; frame-to-frame level; interconnection technology; laser array technology; laser gate arrays; optical interconnections; optimal packaging; parallel optical data links; switching system designers perspective; systems perspective; Bandwidth; Integrated circuit interconnections; Optical arrays; Optical devices; Optical interconnections; Optical transmitters; Packaging; Switching systems; Telecommunication computing; Telecommunication switching;

fLanguage

English

Journal_Title

Lightwave Technology, Journal of

Publisher

ieee

ISSN

0733-8724

Type

jour

DOI

10.1109/50.143082

Filename

143082