Title :
An analytical model for alloyed ohmic contacts using a trilayer transmission line model
Author :
Reeves, Geoffrey K. ; Harrison, H. Bany
Author_Institution :
R. Melbourne Inst. of Technol., Vic., Australia
fDate :
8/1/1995 12:00:00 AM
Abstract :
This paper describes a Transmission Line Model approach to the modeling and analysis of alloyed planar ohmic contacts. It briefly reviews the standard Transmission Line Model (TLM) commonly used to characterize a planar ohmic contact. It is shown that in the case of a typical Au-Ge-Ni alloyed ohmic contact, a more realistic model based on the TLM should take into account the presence of the alloyed layer at the metal-semiconductor interface. In this paper, such a model is described. It is based on three layers and the two interfaces between them, thus forming a Tri-Layer Transmission Line Model (TLTLM). Analytical expressions are derived for the contact resistance Re and the contact end resistance Rc of this structure, together with a current division factor, S. Values for the contact parameters of this TLTLM model are inferred from experimentally reported values of Re and Re for two types of contact. Using the analytical outcomes of the TLTLM, it is shown that the experimental results obtained using a standard TLM can have considerable discrepancies.
Keywords :
alloys; contact resistance; ohmic contacts; semiconductor device metallisation; semiconductor device models; semiconductor-metal boundaries; transmission line theory; AuGeNi; TLM; alloyed ohmic contacts; analytical model; contact end resistance; contact resistance; current division factor; planar ohmic contacts; trilayer transmission line model; Alloying; Analytical models; Contact resistance; Electric variables measurement; Electrical resistance measurement; Gallium arsenide; Metallization; Ohmic contacts; Planar transmission lines; Transmission lines;
Journal_Title :
Electron Devices, IEEE Transactions on