DocumentCode
809374
Title
Frequency domain thickness measurement approach for microscale multilayered structures
Author
Li, Chen ; Cetinkaya, Cetin
Author_Institution
Dept. of Mech. & Aeronaut. Eng., Clarkson Univ., Potsdam, NY, USA
Volume
55
Issue
1
fYear
2006
Firstpage
206
Lastpage
211
Abstract
A frequency domain thickness measurement approach for multilayered structures consisting of micrometer-scale viscoelastic thin layers is introduced. The technique presented in present work is based on a transfer matrix formulation and pulse/echo boundary conditions. The algorithms are developed from a first-principle-based analysis of linear elastic wave propagation in layered structures. An experimental procedure is introduced for determining the natural frequencies of a multilayer structure consisting of highly attenuative layers. Extraction of layer thicknesses from a set of natural frequencies is also demonstrated. One unique feature of the current technique is that it requires acoustic equipment operating at relatively low frequency. Specific challenges due to strong frequency-dependent attenuation in viscoelastic materials are discussed and addressed.
Keywords
acoustic measurement; frequency-domain analysis; multilayers; thickness measurement; transfer function matrices; acoustic equipment; acoustic testing; attenuative layers; frequency domain thickness measurement; frequency-dependent attenuation; layered structures; linear elastic wave propagation; micrometer-scale viscoelastic thin layers; microscale multilayered structures; nondestructive testing; pulse/echo boundary conditions; transfer matrix formulation; viscoelastic materials; Attenuation; Biological materials; Boundary conditions; Elasticity; Frequency domain analysis; Nonhomogeneous media; Parameter estimation; Signal to noise ratio; Thickness measurement; Viscosity; Acoustic testing; multilayered structures; multilayers; nondestructive testing; thickness measurement; transfer matrix formulation;
fLanguage
English
Journal_Title
Instrumentation and Measurement, IEEE Transactions on
Publisher
ieee
ISSN
0018-9456
Type
jour
DOI
10.1109/TIM.2005.860866
Filename
1583882
Link To Document