• DocumentCode
    81045
  • Title

    Application of Silicon on Nothing Structure for Developing a Novel Capacitive Absolute Pressure Sensor

  • Author

    Xiuchun Hao ; Tanaka, Shoji ; Masuda, Atsushi ; Nakamura, Jun ; Sudoh, Koichi ; Maenaka, Kazusuke ; Takao, Hidekuni ; Higuchi, Kenichi

  • Author_Institution
    Maenaka Human-Sensing Fusion Project, Himeji, Japan
  • Volume
    14
  • Issue
    3
  • fYear
    2014
  • fDate
    Mar-14
  • Firstpage
    808
  • Lastpage
    815
  • Abstract
    In the field of silicon on nothing (SON) structure , micrometer-thick monocrystalline layers suspended over their parent wafer were produced by high-temperature annealing of specific arrays of trenches. Those trenches reorganize into one single void and leave a thin overlayer on top. Since this method may be an easy way of synchronous fabricating high-quality silicon films and vacuum void, this paper investigates its potential applications for a pressure sensor. A capacitive absolute pressure sensor whose pressure sensitive membrane is formed by the SON structure was fabricated and evaluated. The radius and thickness of the sensitive membrane are 100 and 1.7-μm, respectively. The average sensitivity of the sensor array with 15 diaphragms is 2.88 fF/kPa. This novel fabrication process enables to easily form a high vacuum cavity without hermetical sealing process such as anodic bonding technology, to achieve an excellent long-term stability and reliability, in particular, and to easily integrate detection circuits with the sensor.
  • Keywords
    annealing; capacitive sensors; pressure sensors; silicon; SON structure; capacitive absolute pressure sensor; silicon on nothing structure; vacuum annealing; Annealing; Capacitive sensors; Cavity resonators; Electrodes; Sensitivity; Silicon; Absolute pressure sensor; capacitive; silicon on nothing; vacuum annealing;
  • fLanguage
    English
  • Journal_Title
    Sensors Journal, IEEE
  • Publisher
    ieee
  • ISSN
    1530-437X
  • Type

    jour

  • DOI
    10.1109/JSEN.2013.2288681
  • Filename
    6655922