Title :
Optoelectronic interconnection technology in the HOLMS system
Author :
Lukowicz, Paul ; Jahns, Jürgen ; Barbieri, R. ; Benabes, P. ; Bierhoff, T. ; Gauthier, A. ; Jarczynski, M. ; Russell, G.A. ; Schrage, J. ; Süllau, W. ; Snowdon, J.F. ; Wirz, M. ; Tröster, G.
Author_Institution :
Electron. Lab., Eidgenossische Tech. Hochschule, Zurich, Switzerland
Abstract :
The High-Speed Optoelectronic Memory Systems (HOLMS) project, sponsored by the European Union Information Society Technology program, aims to make the use of board level optical interconnection in information systems practical and economical by developing optoelectronic packaging technology compatible with standard electronic assembly processes. To demonstrate the potential of the technology, we develop a demonstrator system that addresses the most pressing problem of contemporary computer architecture, memory latency. This paper describes the key ideas and some preliminary results of the HOLMS projects focusing on electronic interconnection technology, in particular optoelectronic packaging issues.
Keywords :
integrated circuit interconnections; integrated circuit packaging; integrated optoelectronics; memory architecture; multichip modules; optical computing; optical interconnections; printed circuit accessories; HOLMS system; High-Speed Optoelectronic Memory Systems project; board level optical interconnection; computer architecture; demonstrator system; electronic assembly process compatibility; memory architecture; memory latency; optical computing; optoelectronic interconnection technology; optoelectronic multichip modules; optoelectronic packaging technology; Assembly systems; Computer architecture; Electronics packaging; High speed optical techniques; Integrated circuit interconnections; Optical computing; Optical interconnections; Optimized production technology; Paper technology; Very large scale integration;
Journal_Title :
Selected Topics in Quantum Electronics, IEEE Journal of
DOI :
10.1109/JSTQE.2003.815492
