DocumentCode
811775
Title
Application of Wigner-Ville distribution in electromigration noise analysis
Author
Tan, Cher Ming ; Lim, Shin Yeh
Author_Institution
Sch. of Electr. & Electron. Eng., Nanyang Technol. Univ., Singapore
Volume
2
Issue
2
fYear
2002
fDate
6/1/2002 12:00:00 AM
Firstpage
30
Lastpage
35
Abstract
Electromigration noise analysis has shown great potential for the nondestructive evaluation of electromigration performance of metal stripe. However, contradictive conclusions have been published from the electromigration noise analysis. These contradictive conclusions mainly stem from the complex dynamics of the atomic movement during electromigration, rendering the electromigration noise as a nonstationary signal, and, hence, the standard Fourier transform is not adequate. Among the various nonstationary signal analysis tools, Wigner-Ville distribution is used for the analysis of electromigration noise data for the first time. It is found that much "hidden" and useful information in the noise data can be revealed by using this distribution. These information will enable us to "see" the dynamic of the atomic movement during electromigration, enhancing our understanding of electromigration processes.
Keywords
Wigner distribution; electromigration; nondestructive testing; semiconductor device metallisation; semiconductor device noise; semiconductor device reliability; semiconductor device testing; Wigner-Ville distribution; electromigration noise analysis; metal stripe; metallization; nondestructive evaluation; nonstationary signal; Electromigration; Low-frequency noise; Noise measurement; Optical noise; Optical scattering; Performance analysis; Signal analysis; Stress; Temperature sensors; Testing;
fLanguage
English
Journal_Title
Device and Materials Reliability, IEEE Transactions on
Publisher
ieee
ISSN
1530-4388
Type
jour
DOI
10.1109/TDMR.2002.802114
Filename
1030873
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