Title :
A color vision inspection system for integrated circuit manufacturing
Author :
Barth, Matthew ; Hirayama, David ; Beni, Gerardo ; Hackwood, Susan
Author_Institution :
Coll. of Eng., California Univ., Riverside, CA, USA
fDate :
11/1/1992 12:00:00 AM
Abstract :
An inspection system is introduced that can measure critical film thicknesses, segment IC images, and detect an entire class of color defects that would be difficult or impossible to detect with typical gray-scale imaging. This inspection is carried out on a unique multiwindow parallel hardware architecture which allows the inspection process to be performed at high speeds. The inspection is based on image understanding techniques and is carried out in a two-stage fashion where defects are first rapidly hypothesized and then verified in detail only within the salient regions of an image, thus eliminating a large amount of irrelevant data. The system has been tested on numerous IC images and shows promising results
Keywords :
automatic optical inspection; image processing equipment; image recognition; integrated circuit manufacture; parallel architectures; thickness measurement; AOI; color vision inspection system; critical film thicknesses; image understanding techniques; integrated circuit manufacturing; multiwindow parallel hardware architecture; segment IC images; Circuit testing; Design automation; Inspection; Integrated circuit manufacture; Integrated circuit reliability; Integrated circuit testing; Machine vision; Manufacturing processes; Pixel; Very large scale integration;
Journal_Title :
Semiconductor Manufacturing, IEEE Transactions on
