Title :
Interconnection parameter extraction of printed circuit board by hybrid measurements of TDR and S-parameter
Author :
Kim, Yong-Ju ; Wee, Jae-Kyung ; Kim, Young-Hee ; Lee, Seongsoo
Author_Institution :
Memory Res. & Dev. Div., Hynix Semicond. Inc., Kyunggi, South Korea
fDate :
8/15/2002 12:00:00 AM
Abstract :
A modified technique for extracting the electrical parameters of transmission lines on PCBs is proposed. It exploits hybrid measurements of the time domain and frequency domain responses and does not require complicated and erroneous procedures such as DC capacitance measurement and parameter de-embedding. Experimental results show that the proposed method is more accurate than conventional methods
Keywords :
S-parameters; electric variables measurement; interconnections; printed circuit testing; time-domain reflectometry; transmission line theory; PCBs; S-parameters; electrical parameters; frequency domain response; hybrid measurements; interconnection parameter extraction; printed circuit board; time domain reflectometry; time domain response; transmission lines;
Journal_Title :
Electronics Letters
DOI :
10.1049/el:20020683
