Title :
Silicon-Embedded Receiving Coil for High-Efficiency Wireless Power Transfer to Implantable Biomedical ICs
Author :
Wu, Rongxiang ; Raju, Salahuddin ; Chan, Mansun ; Sin, Johnny K O ; Yue, C. Patrick
Author_Institution :
Dept. of Electron. & Comput. Eng., Hong Kong Univ. of Sci. & Technol., Kowloon, China
Abstract :
In this letter, a silicon-embedded receiving coil is designed and fabricated for high-efficiency wireless power transfer to implantable biomedical ICs. The 4.5 mm × 4.5 mm embedded receiving coil achieved a large inductance of 4 μH and a high peak quality factor of 20 at 2.8 MHz. Measurement results of an inductive power link using the embedded receiving coil and a conventional printed-circuit-board transmitting coil (2 cm × 2 cm) demonstrated peak voltage gains of 0.84 and 0.24 and peak efficiency values of 30% and 4.3% for separation distances of 5 and 12 mm, respectively. This is the best reported wireless power transmission efficiency for separation distance similar to the implant chip size.
Keywords :
Q-factor; biomedical electronics; coils; elemental semiconductors; inductive power transmission; prosthetics; silicon; frequency 2.8 MHz; implantable biomedical integrated circuits; inductive power link; peak quality factor; printed circuit board transmitting coil; silicon embedded receiving coil; size 2 cm; size 4.5 mm; wireless power transfer; wireless power transmission efficiency; Coils; Educational institutions; Implants; Inductors; Prototypes; Silicon compounds; Wireless communication; Implantable biomedical devices; monolithic inductors; wireless power transfer;
Journal_Title :
Electron Device Letters, IEEE
DOI :
10.1109/LED.2012.2225135
