Title :
Millimeter-wave materials processing in Japan by high-power gyrotron
Author_Institution :
Joining & Welding Res. Inst., Osaka Univ., Japan
Abstract :
This paper summarizes recent research activities on materials processing using millimeter-waves in Japan with emphasis on the work performed at the Joining and Welding Research Institute (JWRI), Osaka University. Extensive research results conducted at the JWRI on ceramics sintering and modification of thin film properties with millimeter-wave radiation from a 28-GHz gyrotron are described. In the sintering of pure Al2O3, it was found that at a similar density and grain size a big difference in the bending strength appeared in the sample after millimeter-wave sintering as compared with that after conventional sintering. This result was attributed to come from the difference in the grain boundary structures due to the unique millimeter-wave effect. We have also obtained highly dense sintered Si3N4 and Aluminum Nitride (AlN) by the millimeter-wave method with new sintering aids containing Yb2O3 at a temperature lower by about 200°C-400°C than that by the conventional method. It was verified that selective heating of Yb2O3 by millimeter-waves around the grain boundary promoted a densification process in its liquid phase. A high thermal conductivity of 210 W/m·°C could be obtained in AlN samples sintered at 1700°C for 180 min in N2+ 3% H2 gas environment. In the research of thin-film modification the millimeter-wave irradiation to SrTiO3 films prepared by mirror-confinement-type electron cyclotron resonance (MCECR) plasma sputtering method could drastically improve their crystallinity and electrical properties at remarkably lower temperatures than by the conventional thermal methods. The crystallization temperature of amorphous films on Si substrates were 300°C and the dielectric constant reached to about 260.
Keywords :
ceramics; crystallisation; dielectric thin films; grain boundaries; gyrotrons; insulating thin films; materials preparation; microwave heating; permittivity; sintering; 1700 C; 180 min; 200 to 400 C; 28 GHz; AIN; Al2O3; AlN; Si substrates; Si3N4; SrTiO3; SrTiO3 films; Yb2O3; amorphous films; ceramics; crystallinity; crystallization temperature; densification process; density; dielectric constant; electrical properties; grain boundary structures; grain size; gyrotron; high-power gyrotron; liquid phase; millimeter-wave irradiation; millimeter-wave materials processing; millimeter-wave radiation; millimeter-wave sintering; mirror-confinement-type electron cyclotron resonance plasma sputtering method; selective heating; thermal conductivity; thin film properties; Crystallization; Grain boundaries; Gyrotrons; Materials processing; Millimeter wave technology; Plasma properties; Plasma temperature; Sputtering; Thermal conductivity; Welding;
Journal_Title :
Plasma Science, IEEE Transactions on
DOI :
10.1109/TPS.2003.818401