Title :
Computer-aided double matching via parametric representation of Brune functions
Author :
Yarman, Binboga Siddik ; Fettweis, Alfred
Author_Institution :
Lehrstuhl fuer Nachrichtentech., Ruhr Univ., Bochum, West Germany
fDate :
2/1/1990 12:00:00 AM
Abstract :
A new computer-aided broadband matching technique, the so-called parametric approach, is applied to double-matching problems. The technique takes less computation time and yields superior gain performance over the other available brute-force CAD techniques. Examples are presented to exhibit the practical use of the parametric approach. The results obtained are compared with those obtained via the real-frequency-direct-computational technique, which offers superior design performance with simple equalizer structures. The real-frequency techniques of broadbanding are implemented with several computational phases in which data-fitting processes, explicit factorization of real polynomials, and solution of a set of linear equations are required. The proposed parametric approach is a reformulation of the real-frequency techniques that eliminates the laborious numerical computations of the latter. The approach involves the parametric representation of Brune functions. Neither the use of explicit factorization of polynomials nor the solution of linear equation systems is necessary. Thus, the parametric method of broadband matching requires less computation with improved numerical stability
Keywords :
circuit CAD; impedance matching; multiport networks; Brune functions; computation time; computational phases; computer-aided broadband matching technique; data-fitting processes; equalizer structures; explicit factorization; gain performance; linear equation systems; linear equations; numerical stability; parametric representation; real polynomials; real-frequency techniques; real-frequency-direct-computational technique; Design automation; Equalizers; Equations; Frequency; Helium; Numerical stability; Performance gain; Polynomials; Power generation; Transfer functions;
Journal_Title :
Circuits and Systems, IEEE Transactions on