Improved ON-State Reliability of Atom Switch Using Alloy Electrodes

Author

Tada, Mitsunori ; Sakamoto, Takanori ; Banno, N. ; Okamoto, K. ; Iguchi, Noriyuki ; Hada, Hiromitsu ; Miyamura, Makoto

Author_Institution

Low-Power Electron. Assoc. & Project, Tsukuba, Japan

Volume

60

Issue

10

fYear

2013

fDate

Oct. 2013

Firstpage

3534

Lastpage

3540

Abstract

Cu-alloy active-electrode coupled with Ru-alloy inert electrode is proposed to improve the ON-state reliability of nonvolatile Cu atom switch. The high rupture temperature (T_r > 400 °C) of the nanometer-scale Cu bridge with high thermal resistance (R_th) is realized by the Cu(AlTi)-alloy without increasing programming current. The anti-Cu diffusive Ru(Ta) alloy contributes to improve the retention of the ON-state at 150 °C and endurance to > 10⁴ cycles. The metallurgical prescription on the electrodes is a key to improve the stability of the nanometer-scale conducting bridge while keeping the switching power low.

Keywords

aluminium alloys; copper alloys; electrodes; fracture; metallurgy; microswitches; reliability; ruthenium alloys; tantalum alloys; thermal resistance; titanium alloys; Cu atom switch; Cu-alloy active-electrode; CuAlTi; Ru-alloy; RuTa; alloy electrodes; antiCu diffusive RuTa alloy; inert electrode; metallurgical prescription; nanometer-scale Cu bridge; on-state reliability; rupture temperature; temperature 150 degC; thermal resistance; Atomic layer deposition; Bridge circuits; Bridges; Electrodes; Metals; Switches; Thermal stability; Atom switch; field-programmable gate array (FPGA); nonvolatile memory; polymer; programmable logic device (PLD); reconfigurable logic; solid-electrolyte;

fLanguage

English

Journal_Title

Electron Devices, IEEE Transactions on

Publisher

ieee

ISSN

0018-9383

Type

jour

DOI

10.1109/TED.2013.2275188

Filename

6578199