Title : 
On the stability of MIMO EWMA run-to-run controllers with metrology delay
         
        
            Author : 
Good, Richard P. ; Qin, S.Joe
         
        
            Author_Institution : 
Automated Precision Manuf., Adv. Micro Devices, Inc, Dresden, Germany
         
        
        
        
        
        
        
            Abstract : 
As production requirements in semiconductor manufacturing continue to escalate, it is rarely possible to perform quality measurements on a product before subsequent process operations are performed. This delay between manufacturing and metrology coupled with inaccurate process models can lead to closed-loop instabilities. This paper investigates the effect of metrology delay on the closed-loop stability of a multiple input-multiple output exponentially weighted moving average run-to-run controller. The generalized Routh-Hurwitz stability criteria are used to derive the necessary and sufficient conditions for stability. A sufficient condition for stability is then derived for systems with any length of metrology delay. This condition states that if all of the eigenvalues of a model-mismatch matrix fall inside a circle with unit radius and centered at {1,0} on the complex plane, then the closed-loop system is stable.
         
        
            Keywords : 
MIMO systems; closed loop systems; eigenvalues and eigenfunctions; moving average processes; process control; semiconductor device manufacture; stability criteria; Routh-Hurwitz stability criteria; closed-loop system; eigenvalues; metrology delay; model-mismatch matrix; multiple input-multiple output exponentially weighted moving average; process models; process operations; run-to-run controller; semiconductor manufacturing; Delay; MIMO; Manufacturing processes; Metrology; Performance evaluation; Production; Semiconductor device manufacture; Stability criteria; Sufficient conditions; Virtual manufacturing; Exponentially weighted moving average (EWMA); measurement delay; run-to-run control; stability;
         
        
        
            Journal_Title : 
Semiconductor Manufacturing, IEEE Transactions on
         
        
        
        
        
            DOI : 
10.1109/TSM.2005.863211