DocumentCode :
815991
Title :
Uncertainty Analysis of Two-Step and Three-Step Methods for Deembedding On-Wafer RF Transistor Measurements
Author :
Cha, Junyoung ; Cha, Jiyong ; Lee, Seonghearn
Author_Institution :
Dept. of Electron. Eng., Hankuk Univ. of Foreign Studies, Yongin
Volume :
55
Issue :
8
fYear :
2008
Firstpage :
2195
Lastpage :
2201
Abstract :
In order to investigate the deembedding uncertainties in the most commonly used deembedding methods, fmax and fT deembedded from two- and three-step ones are compared with those of an accurate pad-open-short technique requiring an additional pad open pattern. The lower fmax and higher fT values from these deembedding methods than those of the pad-open-short technique considering the distributed effect are obtained in an actual MOSFET with Lg = 0.13 mum. The deembedding uncertainty of two- and three-step methods is reduced without the pad open pattern by a simple deembedding technique using extrinsic and intrinsic admittances in specific splitting fractions.
Keywords :
MOSFET circuits; S-parameters; integrated circuit testing; measurement uncertainty; radiofrequency integrated circuits; MOSFET; S-parameter measurement; deembedding methods; deembedding on-wafer RF transistor measurements; extrinsic admittance; intrinsic admittance; specific splitting fractions; Circuit testing; Coupling circuits; Equivalent circuits; Integrated circuit interconnections; Integrated circuit measurements; MOSFET circuits; Parasitic capacitance; Probes; Radio frequency; Scattering parameters; $S$-parameter measurement; CMOS; MOSFET; RF; deembedding; interconnection; on-wafer measurements; pad; transistor;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/TED.2008.926752
Filename :
4578835
Link To Document :
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