Title :
Effect of FN stress and gate-oxide breakdown on high-frequency noise characteristics in deep-submicrometer nMOSFETs
Author :
Rong Zeng ; Hong Wang
Author_Institution :
Microelectron. Center, Nanyang Technol. Univ., Singapore
fDate :
6/1/2005 12:00:00 AM
Abstract :
The impact of Fowler-Nordheim (FN) stress and oxide breakdown on high-frequency noise characteristics in 0.18 μm nMOSFET has studied. Noise characteristics of the devices at different leakage levels and breakdown hardness are compared. The results have shown a strong dependence of degradation of noise parameter on the gate leakage. The degradation mechanisms are analyzed by extraction of the channel and gate noise using a noise equivalent circuit model. It has been found that gate shot noise, which is commonly ignored in the as-processed nMOSFET, plays a dominant role in determining the high frequency noise in the post-oxide breakdown nMOSFET. The effect of FN stress and oxide breakdown is negligible.
Keywords :
MOSFET; equivalent circuits; leakage currents; semiconductor device breakdown; semiconductor device models; semiconductor device noise; semiconductor device reliability; 0.18 micron; FN stress; Fowler-Nordheim stress; breakdown hardness; channel noise; deep-submicrometer nMOSFET; gate leakage; gate noise; gate shot noise; gate-oxide breakdown; high-frequency noise characteristics; noise equivalent circuit model; noise model; noise parameter degradation; post-oxide breakdown nMOSFET; Breakdown voltage; Circuit noise; Degradation; Electric breakdown; Integrated circuit reliability; MOSFETs; Noise measurement; Radio frequency; Thermal stresses; Very large scale integration; CMOS; high-frequency noise; noise model; oxide breakdown; reliability;
Journal_Title :
Electron Device Letters, IEEE
DOI :
10.1109/LED.2005.848102