DocumentCode
816171
Title
The effects of device dimensions on the post-breakdown characteristics of ultrathin gate oxides
Author
Wu, Ernest Y. ; Suñé, Jordi
Author_Institution
IBM Microelectron. Div., Essex Junction, VT, USA
Volume
26
Issue
6
fYear
2005
fDate
6/1/2005 12:00:00 AM
Firstpage
401
Lastpage
403
Abstract
The effects of transistor channel length and width on post breakdown (BD) characteristics have been carefully investigated. As channel-length decreases, we have found that the probability of hard breakdown (HBD) increases and the soft breakdown (SBD) stability time decreases. However, these two quantities are found to be relatively insensitive to the channel width for long channel-length devices. Since SBD is unstable and finally causes the device failure, the so-called HBD prevalence ratio methodology has limitations which are particularly important in short-channel length devices. Our findings indicate that dimensional effects should be properly taken into account in the consideration of circuit reliability and for the application of any post-BD methodology.
Keywords
field effect transistors; semiconductor device breakdown; semiconductor device reliability; HBD prevalence ratio methodology; device dimensions; device reliability; dielectric breakdown; hard breakdown probability; post-breakdown characteristics; progressive breakdown; soft breakdown stability time; transistor channel length; transistor channel width; ultrathin gate oxides; Degradation; Digital circuits; Electric breakdown; MOS devices; Microelectronics; Residual stresses; Stability; Statistics; Dielectric breakdown; MOS devices; TDDB; progressive breakdown; reliability; soft and hard breakdowns;
fLanguage
English
Journal_Title
Electron Device Letters, IEEE
Publisher
ieee
ISSN
0741-3106
Type
jour
DOI
10.1109/LED.2005.848072
Filename
1432912
Link To Document