DocumentCode
816276
Title
A 1.8-V 128-Mb 125-MHz multilevel cell flash memory with flexible read while write
Author
Elmhurst, Daniel ; Goldman, Matthew
Author_Institution
Intel Corp., Folsom, CA, USA
Volume
38
Issue
11
fYear
2003
Firstpage
1929
Lastpage
1933
Abstract
Application of multilevel cell (MLC) technology to a flexible read-while-write flash memory has been achieved through the use of a highly optimized sensing architecture. The goal of this implementation is to provide performance on par with single-bit-per-cell implementations while significantly reducing the overall die size. In order to achieve the required high-speed operation using MLC structures, all offsets to the sense amplifier were minimized and the column load and local sense amplifier were optimized to provide ample differential gain. Through the use of these optimization techniques, a 1.8-V MLC-based flexible read-while-write memory with 125-MHz continuous burst and 40-ns random read access time has been manufactured. Using a 0.13-μm technology, this new device provides a die size that is 25% of the size of the equivalent single-bit-per-cell device manufactured on a 0.18-μm technology.
Keywords
VLSI; circuit optimisation; flash memories; high-speed integrated circuits; integrated memory circuits; 0.13 micron; 1.8 V; 125 MHz; 128 Mbit; 40 ns; flexible read while write; high-speed operation; multilevel cell flash memory; multilevel cell technology; optimization techniques; optimized sensing architecture; parallel sensing; sense amplifier offsets minimization; Costs; Differential amplifiers; Flash memory; Flexible manufacturing systems; Lithography; Mirrors; Nonvolatile memory; Operational amplifiers; Read-write memory; Solid state circuits;
fLanguage
English
Journal_Title
Solid-State Circuits, IEEE Journal of
Publisher
ieee
ISSN
0018-9200
Type
jour
DOI
10.1109/JSSC.2003.818144
Filename
1240973
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