DocumentCode :
816386
Title :
Thermal design and optimization of natural convection polymer pin fin heat sinks
Author :
Bahadur, Raj ; Bar-Cohen, Avram
Author_Institution :
Univ. of Maryland, College Park, MD, USA
Volume :
28
Issue :
2
fYear :
2005
fDate :
6/1/2005 12:00:00 AM
Firstpage :
238
Lastpage :
246
Abstract :
The design and optimization methodology of a thermally conductive polyphenylene sulphide (PPS) polymer staggered pin fin heat sink, for an advanced natural convection cooled microprocessor application, are described using existing analytical equations. The geometric dependence of heat dissipation and the relationships between the pin fin height, pin diameter, horizontal spacing, and pin fin density for a fixed base area and excess temperature are discussed. Experimental results of a pin finned thermally conductive PPS heat sink in natural convection indicate substantially high thermal performance. Numerical results substantiate analytical modeling results for heat sinks within the Aihara et al. fin density range. The cooling rates and coefficient of thermal performance, COPT, that relates cooling capability to the energy invested in the formation of the heat sink, has been determined for such heat sinks and compared with conventional aluminum heat sinks.
Keywords :
cooling; electronics packaging; heat sinks; natural convection; optimisation; polymers; thermal conductivity; PPS heat sink; aluminum heat sinks; analytical modeling; cooling capability; heat dissipation; microprocessor; natural convection polymer; optimization methodology; pin fin heat sink; polyphenylene sulphide polymer; thermal design; thermally conduction; Analytical models; Cooling; Design methodology; Design optimization; Equations; Heat sinks; Microprocessors; Polymers; Temperature dependence; Thermal conductivity; Energy efficient; heat sinks; least material; polyphenylene sulphide (PPS) polymer; sustainability; thermally conductive;
fLanguage :
English
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-3331
Type :
jour
DOI :
10.1109/TCAPT.2005.848498
Filename :
1432931
Link To Document :
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