• DocumentCode
    816386
  • Title

    Thermal design and optimization of natural convection polymer pin fin heat sinks

  • Author

    Bahadur, Raj ; Bar-Cohen, Avram

  • Author_Institution
    Univ. of Maryland, College Park, MD, USA
  • Volume
    28
  • Issue
    2
  • fYear
    2005
  • fDate
    6/1/2005 12:00:00 AM
  • Firstpage
    238
  • Lastpage
    246
  • Abstract
    The design and optimization methodology of a thermally conductive polyphenylene sulphide (PPS) polymer staggered pin fin heat sink, for an advanced natural convection cooled microprocessor application, are described using existing analytical equations. The geometric dependence of heat dissipation and the relationships between the pin fin height, pin diameter, horizontal spacing, and pin fin density for a fixed base area and excess temperature are discussed. Experimental results of a pin finned thermally conductive PPS heat sink in natural convection indicate substantially high thermal performance. Numerical results substantiate analytical modeling results for heat sinks within the Aihara et al. fin density range. The cooling rates and coefficient of thermal performance, COPT, that relates cooling capability to the energy invested in the formation of the heat sink, has been determined for such heat sinks and compared with conventional aluminum heat sinks.
  • Keywords
    cooling; electronics packaging; heat sinks; natural convection; optimisation; polymers; thermal conductivity; PPS heat sink; aluminum heat sinks; analytical modeling; cooling capability; heat dissipation; microprocessor; natural convection polymer; optimization methodology; pin fin heat sink; polyphenylene sulphide polymer; thermal design; thermally conduction; Analytical models; Cooling; Design methodology; Design optimization; Equations; Heat sinks; Microprocessors; Polymers; Temperature dependence; Thermal conductivity; Energy efficient; heat sinks; least material; polyphenylene sulphide (PPS) polymer; sustainability; thermally conductive;
  • fLanguage
    English
  • Journal_Title
    Components and Packaging Technologies, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3331
  • Type

    jour

  • DOI
    10.1109/TCAPT.2005.848498
  • Filename
    1432931