Title :
Ebullition characteristics of an isolated surface microstructure for immersion cooled heat sinks
Author :
Medavaram, Gayathri L. ; Bhavnani, Sushil H. ; Jaeger, Richard C.
Author_Institution :
Dept. of Mech. Eng., Auburn Univ., AL, USA
fDate :
6/1/2005 12:00:00 AM
Abstract :
An understanding of the fundamentals of the boiling mechanism is essential if phase-change liquid immersion cooling is to emerge as a cooling option for the next generation of data servers and other high performance electronics. The present work is an experimental study on the effect of cavity mouth size on the nucleation characteristics of a single isolated micro-pyramidal reentrant cavity. Cavity mouth size has long been known to be a primary variable determining the ebullition characteristics of microscopic structures present on a pool boiling heat sink surface. Isolated pyramidal shaped cavities with square mouth sizes of 7, 19, and 25μm etched in polished silicon using an anisotropic etch were evaluated in this study. Serpentine thin film heaters (6.9mm × 6.9mm) deposited on a Borofloat glass substrate and anodically bonded to the silicon cavity section served as heat sources. All experiments were conducted at atmospheric pressure in dielectric fluids, HFE-7100 and FC-72, popular in thermal management applications. High speed photography (up to 600frames/s) was used to record and quantify the effect of heat flux on bubble departure frequency and departure diameter under subcooled and saturated conditions. The bubble departure diameter increased with an increase in the cavity mouth size. Frequency and bubble departure size, both decreased with increased subcooling.
Keywords :
boiling; bubbles; cooling; heat sinks; nucleation; solid structure; thermal management (packaging); voids (solid); 19 micron; 25 micron; 6.9 mm; 7 micron; Borofloat glass substrate; FC-72; HFE-7100; anisotropic etch; boiling heat sink surface; boiling mechanism; bubble departure diameter; bubble departure frequency; cavity mouth size; dielectric fluids; ebullition characteristics; heat flux; heat sinks; heat sources; high speed photography; isolated micropyramidal reentrant cavity; isolated surface microstructure; liquid immersion cooling; microscopic structures; nucleation characteristics; phase-change; serpentine thin film heaters; silicon cavity section; thermal management; Dielectric substrates; Dielectric thin films; Etching; Frequency; Heat sinks; Immersion cooling; Microstructure; Mouth; Silicon; Thermal management; Bubble departure diameter; departure frequency; dielectric fluids; heat sinks; immersion cooling; reentrant cavity;
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
DOI :
10.1109/TCAPT.2005.848535