DocumentCode :
816435
Title :
Thermal annealing of trapped holes in SIMOX buried oxides
Author :
Pennise, Christine A. ; Boesch, H. Edwin, Jr.
Author_Institution :
Harry Diamond Lab., Adelphi, MD, USA
Volume :
38
Issue :
6
fYear :
1991
fDate :
12/1/1991 12:00:00 AM
Firstpage :
1240
Lastpage :
1246
Abstract :
The thermal detrapping of radiation-generated trapped holes in SIMOX (separation by implantation of oxygen) buried oxides has been investigated with an isothermal anneal experiment. Recovery from the radiation damage exhibits Arrhenius behavior; the recovery times vary exponentially as a function of inverse temperature. Activation energies range from about 0.45 to 1.65 eV, indicating probable thermal detrapping of holes from a broad distribution in hole trap depths. The high activation energies are an indication that some of the holes are deeply trapped in the oxide
Keywords :
X-ray effects; annealing; hole traps; ion implantation; metal-insulator-semiconductor devices; photoconductivity; semiconductor-insulator boundaries; Arrhenius behavior; MOS BOX capacitors; SIMOX buried oxides; SOI technology; Si-SiO2; Si:O; X-ray irradiation; high activation energies; hole trap depths; isothermal anneal; photoconduction current; radiation damage; radiation-generated trapped holes; recovery times; thermal detrapping; Annealing; Capacitance-voltage characteristics; Isothermal processes; MOS capacitors; Monitoring; Photoconductivity; Radiation effects; Silicon on insulator technology; Temperature; Tunneling;
fLanguage :
English
Journal_Title :
Nuclear Science, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9499
Type :
jour
DOI :
10.1109/23.124099
Filename :
124099
Link To Document :
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