• DocumentCode
    816629
  • Title

    Tenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems

  • Volume
    28
  • Issue
    2
  • fYear
    2005
  • fDate
    6/1/2005 12:00:00 AM
  • Firstpage
    377
  • Lastpage
    377
  • Abstract
    Describes the above-named upcoming conference event. May include topics to be covered or calls for papers.
  • fLanguage
    English
  • Journal_Title
    Components and Packaging Technologies, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3331
  • Type

    jour

  • DOI
    10.1109/TCAPT.2005.850839
  • Filename
    1432950
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=816629