DocumentCode :
816772
Title :
Modeling and Optimal Device Design for 4H-SiC Super-Junction Devices
Author :
Yu, Liangchun ; Sheng, Kuang
Author_Institution :
Dept. of Electr. & Comput. Eng., Rutgers Univ., Rutgers, NJ
Volume :
55
Issue :
8
fYear :
2008
Firstpage :
1961
Lastpage :
1969
Abstract :
In this paper, a new and easy-to-implement analytical model is developed for the breakdown voltage and on-resistance of 4H-SiC superjunction devices. By considering the 2-D charge compensation effects, electric field distribution along the critical path has been modeled, and the device breakdown voltage has been calculated. Charge imbalance effects have also been accounted for. Results from the model have been validated by extensive numerical simulation for a large variety of device dimensions and doping concentrations. The proposed model is simple yet accurate for a relatively complicated and challenging structure. Through a device design example with a given set of constraints, it has been demonstrated that the proposed model can quickly provide an optimum structure for what might take weeks through numerical simulation. It can therefore provide useful guidelines for future developments of superjunction devices on 4H-SiC.
Keywords :
III-V semiconductors; electric breakdown; power semiconductor devices; semiconductor device models; semiconductor doping; silicon compounds; SiC; breakdown voltage; charge compensation effects; charge imbalance effects; device dimensions; doping concentrations; electric field distribution; on resistance; optimal device design; super junction devices; Analytical models; Doping; Electrons; Guidelines; Material properties; Numerical simulation; Semiconductor process modeling; Silicon carbide; Thermal conductivity; Voltage; 4H-SiC; Breakdown voltage; charge imbalance; specific on-resistance; superjunction;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/TED.2008.926648
Filename :
4578901
Link To Document :
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