Title :
Acoustic Monitoring of Nonuniformly Eroded PVD Targets
Author :
Ban, Liang ; Ziarani, Alireza K. ; Cetinkaya, Cetin
Author_Institution :
Praxair Electronics, Orangeburg, NY
Abstract :
Material source disks (sputtering targets) used in the physical vapor deposition process exhibit nonuniform erosion profiles and thickness variations in the radial direction. Noninvasive prediction of the remaining life (end-of-life) on a sputtering target during its normal service is of practical interest in semiconductor manufacturing. Based on the piezoelectric generation/detection of acoustic waves propagating and signal processing techniques, a real-time process monitoring system for predicting the end-of-life of a sputtering target is proposed and implemented. The nonstationary signal processing approaches (the time-frequency (reassigned spectrogram) analysis, the cross-spectral density estimation method, and the cross-correlation technique) were employed in analyzing the acquired ultrasonic waveforms. The advantages and shortcomings of each approach in identifying the status of erosion profiles of the sputtering target are also discussed
Keywords :
acoustic signal detection; acoustic signal processing; erosion; process monitoring; semiconductor device manufacture; spectral analysis; sputter deposition; ultrasonic materials testing; acoustic monitoring; acoustic waves; cross-correlation; cross-spectral density estimation; end-of-life monitoring; erosion profiles; material source disks; physical vapor deposition targets; piezoelectric detection; piezoelectric generation; radial direction; real-time process monitoring system; reassigned spectrogram technique; semiconductor manufacturing; signal processing; sputtering targets; thickness variations; time-frequency analysis; ultrasonic waveforms; Acoustic signal detection; Acoustic signal processing; Atherosclerosis; Chemical vapor deposition; Monitoring; Semiconductor device manufacture; Semiconductor materials; Signal analysis; Signal generators; Sputtering; Acoustic monitoring; end-of-life monitoring; erosion profiles; physical vapor deposition (PVD) sputtering target; reassigned spectrogram technique;
Journal_Title :
Semiconductor Manufacturing, IEEE Transactions on
DOI :
10.1109/TSM.2006.883592