Title :
Hot topics-trends in advanced packaging technology
Author_Institution :
Interconnection Decision Consulting, Flemington, NJ, USA
Abstract :
Advanced packaging is shifting to greater use of multichip modules (MCMs) for applications, not just those running on mainframes. It is argued that the reasons are threefold: higher performance, smaller size, and lower cost.<>
Keywords :
multichip modules; packaging; advanced packaging technology; multichip modules; Application specific integrated circuits; Costs; Integrated circuit interconnections; Military computing; Multichip modules; Packaging; Silicon; Surface-mount technology; Wiring; Workstations;
