Title :
Simulation of coupled interconnects using waveform relaxation and transverse partitioning
Author :
Nakhla, Natalie M. ; Ruehli, Albert E. ; Nakhla, Michel S. ; Achar, Ramachandra
Author_Institution :
Dept. of Electron., Carleton Univ., Ottawa, Ont., Canada
Abstract :
The large number of coupled lines in an interconnect structure is a serious limiting factor in simulating high-speed circuits. A new method is presented for efficient simulation of large interconnects based on transverse partitioning and waveform relaxation techniques. The computational cost of the proposed algorithm grows linearly with the number of coupled lines. In addition, the algorithm is highly suitable for parallel implementation leading to further significant reduction in the computational complexity.
Keywords :
circuit simulation; equivalent circuits; high-speed integrated circuits; integrated circuit interconnections; circuit simulation; computational complexity; high-speed circuits; interconnect structure; parallel processing; transient simulation; transverse partitioning; waveform relaxation; Central Processing Unit; Circuit simulation; Computational complexity; Computational efficiency; Computational modeling; Coupling circuits; Differential equations; Integrated circuit interconnections; Partitioning algorithms; Transfer functions; High-speed interconnects; macromodeling; parallel processing; transient simulation; transverse partitioning; waveform relaxation;
Journal_Title :
Advanced Packaging, IEEE Transactions on
DOI :
10.1109/TADVP.2005.862656