• DocumentCode
    817986
  • Title

    Uncooled mini-DIL module for 980-nm pump lasers

  • Author

    Li, Jin ; Brattain, Michael ; Rice, Audra K. ; Labudovic, Marko ; Young, Joseph R. ; Cook, Mark ; Ye, Fan ; Davis, Monica K. ; Burka, Michael

  • Author_Institution
    Univ. of Massachusetts, Lowell, MA, USA
  • Volume
    29
  • Issue
    1
  • fYear
    2006
  • Firstpage
    171
  • Lastpage
    177
  • Abstract
    The importance of lower cost while maintaining high performance of erbium-doped fiber amplifiers (EDFAs) is growing with increased bandwidth demand. The uncooled 980-nm miniature dual-inline (Mini-DIL) pump laser is attractive for compact EDFA designs because it offers the advantages of lower cost, smaller footprint, minimal heat generation, and reduced electrical power consumption. In this paper, we report a low-cost uncooled Mini-DIL module designed for 980-nm pump lasers. A three-dimensional finite element analysis model effectively predicts module thermal and stress performance. Experimental results of module power and coupling efficiency stability over assembly processes are presented. A minimum optical output power of 150 mW is achieved in a group of 10 devices across a temperature range of 0°C to 70°C at a drive current of 350 mA with a 1.5-mm raised ridge InGaAs/AlGaAs single quantum well laser chip.
  • Keywords
    finite element analysis; optical fibre amplifiers; quantum well lasers; thermal management (packaging); 0 to 70 C; 1.55 mm; 150 mW; 350 mA; 3D finite element analysis model; 980 nm; InGaAs-AlGaAs; assembly process; electrical power consumption; erbium-doped fiber amplifiers; heat generation; miniature dual-inline pump laser; quantum well laser chip; semiconductor laser; stress performance; thermal performance; uncooled laser; Costs; Erbium-doped fiber amplifier; Erbium-doped fiber lasers; Laser excitation; Laser modes; Optical design; Power generation; Power lasers; Pump lasers; Thermal stresses; Finite-element method; miniature dual-inline (Mini-DIL); semiconductor laser; uncooled laser;
  • fLanguage
    English
  • Journal_Title
    Advanced Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3323
  • Type

    jour

  • DOI
    10.1109/TADVP.2005.849565
  • Filename
    1589144