• DocumentCode
    818123
  • Title

    Characterization and modeling of parasitic emission in deep submicron CMOS

  • Author

    Vrignon, Bertrand ; Bendhia, Sonia Delmas ; Lamoureux, Enrique ; Sicard, Etienne

  • Author_Institution
    Central Res. & Dev., STMicroelectronics, Crolles, France
  • Volume
    47
  • Issue
    2
  • fYear
    2005
  • fDate
    5/1/2005 12:00:00 AM
  • Firstpage
    382
  • Lastpage
    387
  • Abstract
    This paper presents a study of the parasitic emissions of a 0.18-μm CMOS experimental integrated circuit (IC) and an accurate method for modeling the internal current switching to forecast electromagnetic interference (EMI). The effectiveness of emission reduction techniques is quantified through a set of conducted noise measurements. A simple core model is developed, based on the current switching activity. Added to a lumped-element model of the test board and the package, good agreement between simulation and measurements are obtained up to 10 GHz. The simulation methodology may be applied to forecast the impact of low emission design techniques on the EMI of ICs.
  • Keywords
    CMOS integrated circuits; electromagnetic interference; integrated circuit noise; interference suppression; lumped parameter networks; switching; CMOS experimental integrated circuit; EMI; complementary metal-oxide semiconductor; conducted noise measurements; deep submicron CMOS; electromagnetic interference; emission reduction techniques; internal current switching; lumped-element model; parasitic emission; CMOS integrated circuits; Electromagnetic interference; Electromagnetic modeling; Integrated circuit modeling; Noise measurement; Packaging; Predictive models; Semiconductor device modeling; Switching circuits; Testing; Complementary metal–oxide semiconductor (CMOS) technology; electromagnetic compatability (EMC); electromagnetic interference (EMI) modeling; on-chip sampling;
  • fLanguage
    English
  • Journal_Title
    Electromagnetic Compatibility, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9375
  • Type

    jour

  • DOI
    10.1109/TEMC.2005.847408
  • Filename
    1433064