Microcarrier for LSI chip used in the HITAC M-880 processor group

Author

Inoue, Takashi ; Matsuyama, Haruhiko ; Matsuzaki, Eiji ; Narizuka, Yasunori ; Ishino, Masakazu ; Takenaka, Takaji ; Tanaka, Minoru

Author_Institution

Production Eng. Res. Lab., Hitachi Ltd., Yokohama, Japan

Volume

15

Issue

1

fYear

1992

fDate

2/1/1992 12:00:00 AM

Firstpage

7

Lastpage

14

Abstract

The compact chip carrier named MCC has been developed for high density chip level packaging. The MCC realizes the smallest possible hermetic chip package by introducing full surface flip-chip interconnections, thin-film process technology, built-in termination resistors, and a thermal expansion matched ceramic substrate. The structure of the MCC and the thin-film process technology for its fabrication are reported

Keywords

ceramics; large scale integration; packaging; substrates; thermal expansion; HITAC M-880 processor group; LSI chip; MCC; built-in termination resistors; compact chip carrier; fabrication; flip-chip bonding; full surface flip-chip interconnections; hermetic chip package; high density chip level packaging; microcarrier; mullite ceramic substrate; smallest possible package; structure; thermal expansion matched ceramic substrate; thermal expansion matching; thin-film process technology; Bonding; Ceramics; Fabrication; Integrated circuit interconnections; Large scale integration; Packaging; Resistors; Substrates; Thermal expansion; Thin film circuits;

fLanguage

English

Journal_Title

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

0148-6411

Type

jour

DOI

10.1109/33.124188

Filename

124188