A review of the skin effect as applied to thin film interconnections

Author

Hwang, Lih-Tyng ; Turlik, Iwona

Author_Institution

Microelectron. Center of North Carolina, Research Triangle Park, NC, USA

Volume

15

Issue

1

fYear

1992

fDate

2/1/1992 12:00:00 AM

Firstpage

43

Lastpage

55

Abstract

As the rise time of digital pulses is reduced to the subnanosecond range, the skin effect becomes an important issue in high-speed digital systems. The various approaches (theoretical and experimental) which have been taken to study the skin effect are surveyed. Various methods that accommodate the skin effect phenomenon into conductor design rules for high-speed digital systems are examined and compared. The resulting impact of these accommodations on high performance ULSI/VLSI multichip packages is addressed

Keywords

digital circuits; hybrid integrated circuits; packaging; skin effect; thin film circuits; MCM; ULSI; VLSI; conductor design rules; high-speed digital systems; multichip modules; multichip packages; skin effect; thin film interconnections; Conducting materials; Conductivity; Conductors; Current density; Current distribution; Digital systems; Frequency; Skin effect; Surface resistance; Transistors;

fLanguage

English

Journal_Title

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

0148-6411

Type

jour

DOI

10.1109/33.124191

Filename

124191