DocumentCode :
818195
Title :
A review of the skin effect as applied to thin film interconnections
Author :
Hwang, Lih-Tyng ; Turlik, Iwona
Author_Institution :
Microelectron. Center of North Carolina, Research Triangle Park, NC, USA
Volume :
15
Issue :
1
fYear :
1992
fDate :
2/1/1992 12:00:00 AM
Firstpage :
43
Lastpage :
55
Abstract :
As the rise time of digital pulses is reduced to the subnanosecond range, the skin effect becomes an important issue in high-speed digital systems. The various approaches (theoretical and experimental) which have been taken to study the skin effect are surveyed. Various methods that accommodate the skin effect phenomenon into conductor design rules for high-speed digital systems are examined and compared. The resulting impact of these accommodations on high performance ULSI/VLSI multichip packages is addressed
Keywords :
digital circuits; hybrid integrated circuits; packaging; skin effect; thin film circuits; MCM; ULSI; VLSI; conductor design rules; high-speed digital systems; multichip modules; multichip packages; skin effect; thin film interconnections; Conducting materials; Conductivity; Conductors; Current density; Current distribution; Digital systems; Frequency; Skin effect; Surface resistance; Transistors;
fLanguage :
English
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
Publisher :
ieee
ISSN :
0148-6411
Type :
jour
DOI :
10.1109/33.124191
Filename :
124191
Link To Document :
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