Comparative evaluation of optical waveguides as alternative interconnections for high performance packaging

Author

Schacham, S.E. ; Merkelo, Henri ; Hwang, L.-T. ; McCredie, Bradley D. ; Veatch, Mark S. ; Turlik, I.

Author_Institution

MCNC Center for Microelectron., Research Triangle Park, NC, USA

Volume

15

Issue

1

fYear

1992

fDate

2/1/1992 12:00:00 AM

Firstpage

63

Lastpage

72

Abstract

A detailed comparison between optical and electrical interconnections is presented, with the emphasis on advantages and drawbacks of optical link utilization. The impact of attenuation, dispersive degradation, and fan out on signal integrity is discussed. The implementation of a polyimide optical waveguide in the MCNC package is discussed

Keywords

hybrid integrated circuits; integrated optoelectronics; metallisation; modules; optical interconnections; packaging; polymers; MCNC package; attenuation; comparative evaluation; dispersive degradation; electrical interconnections; fan out; high performance packaging; multichip modules; optical interconnections; optical link utilization; polyimide optical waveguide; signal integrity; Frequency; High speed optical techniques; Integrated circuit interconnections; Optical attenuators; Optical fiber communication; Optical interconnections; Optical noise; Optical reflection; Optical waveguides; Packaging;

fLanguage

English

Journal_Title

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

0148-6411

Type

jour

DOI

10.1109/33.124193

Filename

124193