• DocumentCode
    818235
  • Title

    A quantitative technique to analyze materials trade-off for SEM `E´

  • Author

    Ng, Lee H. ; Field, Frank R.

  • Author_Institution
    IBIS Asociates Inc., Wellesley, MA, USA
  • Volume
    15
  • Issue
    1
  • fYear
    1992
  • fDate
    2/1/1992 12:00:00 AM
  • Firstpage
    78
  • Lastpage
    86
  • Abstract
    The standard electronic module (SEM) is defined by a Department of Defense specification designed to optimize electronic module materials and designs for the military, as well as to reduce system life cycle cost through standardization of design and test requirements. The size of the module is defined by its format designation. For example, the E format specifies a substrate dimension of 133 mm (5.25 in) by 152.4 mm (6 in). However, the specification does not define the materials composing the substrate, leaving material specification to the module designer. The performance requirements for SEM E are evaluated using a technique called multiattribute utility analysis (MAUA). This technique has been employed in a wide range of engineering problems in general, and materials specification problems in particular, and its application to this problem yields rich insights into the critical elements of materials selection for the SEM E application
  • Keywords
    design engineering; hybrid integrated circuits; military equipment; packaging; 133 mm; 152.4 mm; Department of Defense specification; E format; MAUA; SEM E; electronic module materials; format designation; materials selection; materials specification; materials trade-off; module size; multiattribute utility analysis; multichip modules; performance requirements; quantitative technique; standard electronic module; standardization of design; substrate dimension; system life cycle cost; test requirement standardization; Cost function; Design engineering; Design optimization; Electronic equipment testing; Life testing; Military standards; Performance analysis; Printed circuits; Reliability engineering; Standardization;
  • fLanguage
    English
  • Journal_Title
    Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0148-6411
  • Type

    jour

  • DOI
    10.1109/33.124195
  • Filename
    124195