Title :
Bias-temperature instabilities and radiation effects in MOS devices
Author :
Zhou, X.J. ; Fleetwood, D.M. ; Felix, J.A. ; Gusev, E.P. ; Emic, C.D.
Author_Institution :
Dept. of Electr. Eng. & Comput. Sci., Vanderbilt Univ., Nashville, TN, USA
Abstract :
We report the combined effects of irradiation and bias temperature stress (BTS) on MOS capacitors with HfO2 dielectrics. Irradiation is found to enhance BTS-induced degradation in these devices; significant differences in the amounts of enhancement are observed for different irradiation biases. Zero-bias or positive-bias irradiation followed by negative BTS (NBTS) leads to much worse degradation than either irradiation or NBTS alone. This is primarily due to the formation of dipoles during irradiation and the electrostatic repulsion of electrons from the oxide during NBTS. In an integrated circuit application, the worst-case response for these gate stacks will be pMOS transistors irradiated in their "off" states, and annealed in their "on" states. The effects of irradiation and BTS are also reported for Al2O3-based MOS capacitors with Al gates and SiO2-based MOS capacitors with NiSi gates for comparison with HfO2. Somewhat less sensitivity to combined irradiation and BTS is observed for the Al2O3-based devices, and significantly less sensitivity to combined effects is observed for the thermal oxides with NiSi gates.
Keywords :
MOS capacitors; MOS integrated circuits; alumina; dielectric materials; hafnium compounds; interface states; radiation hardening (electronics); silicon compounds; Al gates; Al2O3; Al2O3-based MOS capacitors; BTS-induced degradation; HfO2; HfO2 dielectrics; NiSi gates; SiO2; SiO2-based MOS capacitors; bias temperature stress; electrostatic repulsion; gate stacks; integrated circuit application; irradiation biases; irradiation effects; off state; on states; pMOS transistors; positive-bias irradiation; thermal oxides; zero-bias; Degradation; Dielectrics; Electrons; Electrostatics; Hafnium oxide; MOS capacitors; MOS devices; Radiation effects; Stress; Temperature; High-; MOS devices; interface traps; negative-bias temperature instability; oxide-trap charge; radiation hardness assurance;
Journal_Title :
Nuclear Science, IEEE Transactions on
DOI :
10.1109/TNS.2005.860667