DocumentCode
818650
Title
Successive breakdown events and their relation with soft and hard breakdown modes
Author
Wu, E.Y. ; Sune, Jordi
Author_Institution
IBM Microelectron. Div., Essex Junction, VT, USA
Volume
24
Issue
11
fYear
2003
Firstpage
692
Lastpage
694
Abstract
Two alternative statistical descriptions of device and chip failure by multiple breakdown events in thin-oxide MOS devices are compared: the successive breakdown approach and the hard-breakdown prevalence ratio method. Both methods are demonstrated to be compatible descriptions of the experimental breakdown data. It is confirmed that the successive breakdown events are uncorrelated and that the relative probability of soft and hard breakdown is independent of the time to breakdown and of the number of previous breakdown events. As a consequence, the prevalence ratio concept is applied to the distribution of successive events, thus closing the loop of a fully consistent picture. Applications of these statistical methods to reliability assessment are discussed, and the criterion that should guide the choice of methodology is established.
Keywords
MOS capacitors; failure analysis; probability; semiconductor device breakdown; semiconductor device reliability; semiconductor device testing; CMOS technology; TDDB; capacitors; chip failure; device failure; hard breakdown; hard-breakdown prevalence ratio method; multiple breakdown events; previous breakdown events; relative probability; reliability assessment; soft breakdown; statistical descriptions; successive breakdown events; successive event distribution; thin-oxide MOS devices; time to breakdown; CMOS technology; Dielectric breakdown; Dielectric devices; Electric breakdown; MOS devices; Microelectronics; Probability; Space technology; Statistical analysis; Stress;
fLanguage
English
Journal_Title
Electron Device Letters, IEEE
Publisher
ieee
ISSN
0741-3106
Type
jour
DOI
10.1109/LED.2003.819269
Filename
1242330
Link To Document