• DocumentCode
    818655
  • Title

    Effect of Current Crowding on Frequency Response of a Stepped Planar RF Transmission-Line Lowpass Filter for Power Electronics

  • Author

    Campbell, Colin Kydd ; Van Wyk, Jacobus Daniel ; Chen, Rengang

  • Author_Institution
    McMaster Univ., Hamilton, Ont.
  • Volume
    29
  • Issue
    4
  • fYear
    2006
  • Firstpage
    798
  • Lastpage
    803
  • Abstract
    This paper relates to prototype design studies of a stepped-tapered (in width) planar Cu-Al2O3-Ni-BaTiO3-Ni-Al2O 3-Cu radio frequency (RF) lowpass filter for an integrated power electronics module. An empirical cascaded one-dimensional (1-D) current-crowding model, using ABCD matrices, is employed to explain the anomalous, and degraded, high-frequency roll-off slope of the Ni-BaTiO 3-Ni attenuator segment in the desired (wide-to-narrow) forward connection. Good agreement between theory and experiment is obtained with the empirical current-crowding model, which incorporates changes in the resistance and self-inductance of the Ni conductor as functions of current crowding and skin depth. Additional support for postulated current crowding was inferred from two-dimensional (2-D) finite-element analysis (FEA) modeling of the electromagnetic field distributions in the individual attenuator segments. Such studies could serve as an aid to the design of other planar structures of improved tapered or exponential shape for enhancing the high-frequency roll-off response and slope
  • Keywords
    copper; copper compounds; finite element analysis; frequency response; low-pass filters; nickel compounds; power electronics; transmission line matrix methods; 2D finite element analysis; ABCD matrices; Cu-Al2O3-Ni-BaTiO3-Ni-Al2 O3-Cu; current crowding; frequency response; integrated power electronics; lowpass filter; transmission lines; Attenuators; Degradation; Frequency response; Power electronics; Power filters; Prototypes; Proximity effect; Radio frequency; Transmission line matrix methods; Transmission lines; Cu and Ni conductors; current crowding; electromagnetic interference (EMI); finite-element analysis (FEA); inductance crowding; integrated power electronics; modeling; planar lowpass filter; radio frequencies (RF); skin depth;
  • fLanguage
    English
  • Journal_Title
    Advanced Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3323
  • Type

    jour

  • DOI
    10.1109/TADVP.2006.879413
  • Filename
    4012246