DocumentCode
818655
Title
Effect of Current Crowding on Frequency Response of a Stepped Planar RF Transmission-Line Lowpass Filter for Power Electronics
Author
Campbell, Colin Kydd ; Van Wyk, Jacobus Daniel ; Chen, Rengang
Author_Institution
McMaster Univ., Hamilton, Ont.
Volume
29
Issue
4
fYear
2006
Firstpage
798
Lastpage
803
Abstract
This paper relates to prototype design studies of a stepped-tapered (in width) planar Cu-Al2O3-Ni-BaTiO3-Ni-Al2O 3-Cu radio frequency (RF) lowpass filter for an integrated power electronics module. An empirical cascaded one-dimensional (1-D) current-crowding model, using ABCD matrices, is employed to explain the anomalous, and degraded, high-frequency roll-off slope of the Ni-BaTiO 3-Ni attenuator segment in the desired (wide-to-narrow) forward connection. Good agreement between theory and experiment is obtained with the empirical current-crowding model, which incorporates changes in the resistance and self-inductance of the Ni conductor as functions of current crowding and skin depth. Additional support for postulated current crowding was inferred from two-dimensional (2-D) finite-element analysis (FEA) modeling of the electromagnetic field distributions in the individual attenuator segments. Such studies could serve as an aid to the design of other planar structures of improved tapered or exponential shape for enhancing the high-frequency roll-off response and slope
Keywords
copper; copper compounds; finite element analysis; frequency response; low-pass filters; nickel compounds; power electronics; transmission line matrix methods; 2D finite element analysis; ABCD matrices; Cu-Al2O3-Ni-BaTiO3-Ni-Al2 O3-Cu; current crowding; frequency response; integrated power electronics; lowpass filter; transmission lines; Attenuators; Degradation; Frequency response; Power electronics; Power filters; Prototypes; Proximity effect; Radio frequency; Transmission line matrix methods; Transmission lines; Cu and Ni conductors; current crowding; electromagnetic interference (EMI); finite-element analysis (FEA); inductance crowding; integrated power electronics; modeling; planar lowpass filter; radio frequencies (RF); skin depth;
fLanguage
English
Journal_Title
Advanced Packaging, IEEE Transactions on
Publisher
ieee
ISSN
1521-3323
Type
jour
DOI
10.1109/TADVP.2006.879413
Filename
4012246
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