Title :
Hardness-by-design approach for 0.15 μm fully depleted CMOS/SOI digital logic devices with enhanced SEU/SET immunity
Author :
Makihara, A. ; Midorikawa, M. ; Yamaguchi, T. ; Iide, Y. ; Yokose, T. ; Tsuchiya, Y. ; Arimitsu, T. ; Asai, H. ; Shindou, H. ; Kuboyama, S. ; Matsuda, S.
Author_Institution :
High-Reliability Components Corp., Ibaraki, Japan
Abstract :
We designed logic cells hardened for single-event upsets/single-event transients (SEUs/SETs) using hardness-by-design (HBD) methodology on OKI´s 0.15 μm fully depleted complementary metal-oxide-semiconductor/silicon-on-insulator (CMOS/SOI) commercial process and evaluated the sample devices. Our previous work demonstrates that SET-free inverters can be successfully applied as SEU-immune latches. In this paper, the native latches are redesigned using SET-free inverters not only for the inverter loop but also for several types of clock gates (L-SETfree-LoopCK, L-SETfree-LoopCK-SmallArea, and L-SETfree-LoopCK-AddTr.). In addition, the native combinational logic cells are redesigned using SET-free inverters as SET-free NAND and SET-free NOR . Excellent SEU/SET hardness of the HBD latches were achieved up to LET of 64 MeV/(mg/cm2).
Keywords :
CMOS logic circuits; NAND circuits; NOR circuits; flip-flops; logic design; logic gates; radiation hardening (electronics); silicon-on-insulator; L-SETfree-loopCk-smallarea; SET-free NAND; SET-free NOR; SET-free inverters; SEU-immune latches; clock gates; complementary metal-oxide-semiconductor-silicon-on-insulator; digital logic devices; hardened logic cell designs; hardness-by-design methodology; single-event upsets-single-event transients; CMOS logic circuits; CMOS process; Frequency; Immune system; Inverters; Isolation technology; Logic devices; Signal generators; Silicon on insulator technology; Single event upset; Commercial process; fully depleted complementary metal–oxide–semiconductor/silicon-on-insulator (CMOS/SOI); hardness-by-design (HBD); single-event transient (SET); single-event upset (SEU);
Journal_Title :
Nuclear Science, IEEE Transactions on
DOI :
10.1109/TNS.2005.860716