Title :
Design Techniques for Thermal Management in Switch Mode Converters
Author :
De Jong, Erik C W ; Ferreira, J.A. ; Bauer, Pavol
Author_Institution :
EEMCS Fac., Delft Univ. of Technol.
Abstract :
Thermal management plays a pivotal role in achieving high power densities in converters. Improvement on thermal performance of critical components in printed-circuit board (PCB) assembled switch mode converters is achieved by using design techniques that extend across electromagnetic, geometrical, and thermal-integration technologies. For better use of the already available PCB material, three-dimensional component layout and flexible PCB technology are utilized to gain advantages. A theory to evaluate the thermal-management effectiveness of switch mode converters is introduced based on two new figures of merit, namely thermal-management loss density and thermal-design rating. These two figures of merit quantify the effective use of thermal-management material as well as the thermal performance of a converter design. The figure-of-merit criteria allow flexibility so that it can be adjusted to an appropriate design objective. Design objectives include achieving higher power densities or achieving good reliability. The thermal-management-effectiveness theory is applied here to thermally optimize a Flyback converter that has been geometrically integrated. The design technique to adjust the thermal-management effectiveness of integrated switch mode converters to achieve a set objective, by means of the introduced figures of merit, forms the core of the publication, validated by experimental measurements
Keywords :
losses; printed circuits; reliability; switched mode power supplies; thermal management (packaging); PCB; figure-of-merit criteria; flyback converter; loss density; printed circuit board; switch mode converters; thermal management; Assembly; Electronic packaging thermal management; Energy management; Industry Applications Society; Paper technology; Power electronics; Switches; Switching converters; Thermal management; Thermal variables measurement; AC–DC power conversion; design methodology; finite-difference methods (FDMs); optimization methods; printed-circuit board (PCB) assembled power supplies; thermal management; thermal variables control;
Journal_Title :
Industry Applications, IEEE Transactions on
DOI :
10.1109/TIA.2006.882674