Title :
Bond verification of space shuttle tiles using time-domain techniques
Author :
Bennia, Abdelhak ; Su, Wangsheng ; Riad, Sedki M.
Author_Institution :
Virginia Institute Polytechnic and State University
fDate :
4/1/1991 12:00:00 AM
Keywords :
Aluminum; Bonding; Capacitive sensors; Dielectric constant; Pulse measurements; Space shuttles; Space vehicles; Temperature; Tiles; Time domain analysis;
Journal_Title :
Instrumentation and Measurement, IEEE Transactions on
DOI :
10.1109/TIM.1990.1032994
