Title :
Building pixel detector modules in multichip module deposited technology
Author :
Becks, K.-H. ; Flick, T. ; Grah, C. ; Gerlach, P. ; Mättig, P.
Author_Institution :
Dept. of Phys., Univ. of Wuppertal
Abstract :
The MCM-D technique has been used to build hybrid pixel detector modules and single chip assemblies with optimized sensor geometry. Results of test measurements in both a laboratory and a test beam environment are given. Proton irradiation to the ATLAS pixel lifetime of a MCM-D single chip assembly has been carried out
Keywords :
multichip modules; nuclear electronics; position sensitive particle detectors; proton effects; semiconductor counters; sensors; ATLAS detector; MCM-D single chip assembly; bump bonding; flip chip; hybrid pixel detector modules; multichip module deposited technology; optimized sensor geometry; pixel lifetime; proton irradiation; semiconductor detectors; test beam environment; thin film technology; Active matrix technology; Assembly; Bonding; Detectors; Flip chip; Geometry; Multichip modules; Polymer films; Sputtering; Thin film sensors; ATLAS; bump bonding; flip chip; pixel detectors; semiconductor detectors; thin film technology;
Journal_Title :
Nuclear Science, IEEE Transactions on
DOI :
10.1109/TNS.2005.862933
