DocumentCode :
821413
Title :
A Digital-Microfluidic Approach to Chip Cooling
Author :
Paik, Philip Y. ; Pamula, Vamsee K. ; Chakrabarty, Krishnendu
Author_Institution :
ICx Biosystems, La Jolla, CA
Volume :
25
Issue :
4
fYear :
2008
Firstpage :
372
Lastpage :
381
Abstract :
Thermal management has emerged as an increasingly important aspect of IC design. Elevated die temperatures are detrimental to circuit performance and reliability. Furthermore, hot spots due to spatially nonuniform heat flux in ICs can cause physical stress that further reduces reliability. The authors of this article review various chip-cooling techniques that have been proposed in the literature. They then present an alternative approach based on a recently invented digital-microfluidic platform that enables an adaptive cooling technique. This novel digital-fluid-handling platform uses a phenomenon known as electrowetting so that a vast array of discrete droplets of liquid, ranging from microliters to nanoliters and potentially to picoliters, can be independently moved along a substrate. Although this technology was originally developed for a biological and chemical lab on a chip, the authors show how it can be adapted for use as a fully reconfigurable, adaptive cooling platform.
Keywords :
cooling; integrated circuit design; integrated circuit reliability; lab-on-a-chip; microfluidics; thermal management (packaging); wetting; adaptive cooling; biological lab on a chip; chemical lab on a chip; chip cooling; digital fluid handling; digital microfluidic approach; electrowetting; integrated circuit design; integrated circuit reliability; spatially nonuniform heat flux; thermal management; Chemical technology; Cooling; Fans; Feedback; Heat sinks; Microfluidics; Substrates; Temperature; Thermal management; Thermal stresses; adaptive cooling platform; chip cooling; digital microfluidics; fluid flow; heat removal; microfluidics; reconfigurability;
fLanguage :
English
Journal_Title :
Design & Test of Computers, IEEE
Publisher :
ieee
ISSN :
0740-7475
Type :
jour
DOI :
10.1109/MDT.2008.87
Filename :
4584466
Link To Document :
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