Title :
Electromigration and adhesion
Author :
Lloyd, James R. ; Lane, Michael W. ; Liniger, Eric G. ; Hu, C.-K. ; Shaw, Thomas M. ; Rosenberg, Robert
Author_Institution :
IBM T. J. Watson Res. Center, Yorktown Heights, NY, USA
fDate :
3/1/2005 12:00:00 AM
Abstract :
It has been demonstrated that, in those instances where electromigration-induced mass transport is dominated by interfacial diffusion, the adhesion at the interface where mass transport is primarily taking place is related to the electromigration flux. Furthermore, it is shown that the cohesive energy of the interface is directly related to the activation energy for diffusion.
Keywords :
adhesion; electromigration; interface phenomena; mass transfer; activation energy; adhesion; cohesive energy; electromigration flux; electromigration-induced mass transport; interfacial diffusion; Adhesives; Aluminum alloys; Conducting materials; Conductive films; Conductors; Copper alloys; Dielectrics; Electromigration; Metallization; Temperature;
Journal_Title :
Device and Materials Reliability, IEEE Transactions on
DOI :
10.1109/TDMR.2005.846308
