Title :
Adaptive control approach of rapid thermal processing
Author :
Choi, Jin Young ; Do, Hyun Min ; Choi, Hong Seok
Author_Institution :
Sch. of Electr. Eng. & Comput. Sci., Seoul Nat. Univ., South Korea
Abstract :
This paper presents an adaptive control approach for achieving the control of the wafer temperature in a rapid thermal processing system (RTP). Numerous studies have addressed the temperature control problem in RTP and most researches on this problem require exact knowledge of the systems dynamics. However, it is difficult to acquire this exact knowledge. Thus, various approaches cannot guarantee the desired performance in practical application when there exist some modeling errors between the model and the actual system. In this paper, an adaptive control scheme is applied to RTP without exact information on the dynamics. The system dynamics are assumed to be an affine nonlinear form, and the unknown portion of the dynamics are estimated by a neural network referred to a piecewise linear approximation network (PLAN). The controller architecture is based on an adaptive feedback linearization scheme and augmented by sliding mode control. The performance of the proposed method is demonstrated by experimental results on an RTP system of Kornic Systems Corporation, Korea.
Keywords :
adaptive control; feedback; linearisation techniques; neural nets; nonlinear dynamical systems; piecewise linear techniques; process control; rapid thermal processing; semiconductor device manufacture; temperature control; variable structure systems; adaptive control; adaptive feedback linearization; affine nonlinear dynamics; controller architecture; neural network; piecewise linear approximation network; rapid thermal processing; semiconductor manufacturing; sliding mode control; temperature control; Adaptive control; Control systems; Linear feedback control systems; Neural networks; Nonlinear dynamical systems; Piecewise linear approximation; Programmable control; Rapid thermal processing; Sliding mode control; Temperature control;
Journal_Title :
Semiconductor Manufacturing, IEEE Transactions on
DOI :
10.1109/TSM.2003.818961