DocumentCode
822366
Title
Endurance Reliability of Multilevel-Cell Flash Memory Using a
Dual Charge Storage Layer
Author
Zhang, Gang ; Wan Sik Hwang ; Lee, Seung-Hwan ; Cho, Byung-Jin ; Won Jong Yoo
Volume
55
Issue
9
fYear
2008
Firstpage
2361
Lastpage
2369
Abstract
The mechanisms of programming/erasing (P/E) and endurance degradation have been investigated for multilevel-cell (MLC) Flash memories using a (NROM) or a dual charge storage layer (DCSL). Threshold-voltage -level disturbance is found to be the major endurance degradation factor of NROM-type MLCs, whereas separated charge storage and step-up potential wells give rise to a superior -level controllability for DCSL MLCs. The programmed levels of DCSL MLCs are controlled by the spatial charge distribution, as well as the charge storage capacity of each storage layer, rather than the charge injection. As a result, DCSL MLCs show negligible -level offsets (< 0.2 V) that are maintained throughout the P/E cycles, demonstrating significantly improved endurance reliability compared to NROM-type MLCs.
Keywords
flash memories; reliability; silicon compounds; zirconium compounds; ZrO2-Si3N4; charge storage capacity; dual charge storage layer; endurance degradation factor; multilevel-cell flash memory; programming-erasing; spatial charge distribution; threshold-voltage-level disturbance; Channel hot electron injection; Controllability; Degradation; Flash memory; Hot carriers; Maintenance; Nonvolatile memory; Potential well; Silicon; Size control; Dual charge storage layer (DCSL); Flash memory; endurance reliability; multiple-level cell (MLC);
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/TED.2008.927396
Filename
4585394
Link To Document