• DocumentCode
    822366
  • Title

    Endurance Reliability of Multilevel-Cell Flash Memory Using a  \\hbox {ZrO}_{2}/\\hbox {Si}_{3}\\hbox {N}_{4} Dual Charge Storage Layer

  • Author

    Zhang, Gang ; Wan Sik Hwang ; Lee, Seung-Hwan ; Cho, Byung-Jin ; Won Jong Yoo

  • Volume
    55
  • Issue
    9
  • fYear
    2008
  • Firstpage
    2361
  • Lastpage
    2369
  • Abstract
    The mechanisms of programming/erasing (P/E) and endurance degradation have been investigated for multilevel-cell (MLC) Flash memories using a (NROM) or a dual charge storage layer (DCSL). Threshold-voltage -level disturbance is found to be the major endurance degradation factor of NROM-type MLCs, whereas separated charge storage and step-up potential wells give rise to a superior -level controllability for DCSL MLCs. The programmed levels of DCSL MLCs are controlled by the spatial charge distribution, as well as the charge storage capacity of each storage layer, rather than the charge injection. As a result, DCSL MLCs show negligible -level offsets (< 0.2 V) that are maintained throughout the P/E cycles, demonstrating significantly improved endurance reliability compared to NROM-type MLCs.
  • Keywords
    flash memories; reliability; silicon compounds; zirconium compounds; ZrO2-Si3N4; charge storage capacity; dual charge storage layer; endurance degradation factor; multilevel-cell flash memory; programming-erasing; spatial charge distribution; threshold-voltage-level disturbance; Channel hot electron injection; Controllability; Degradation; Flash memory; Hot carriers; Maintenance; Nonvolatile memory; Potential well; Silicon; Size control; Dual charge storage layer (DCSL); Flash memory; endurance reliability; multiple-level cell (MLC);
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/TED.2008.927396
  • Filename
    4585394